Invention Grant
- Patent Title: Mask, method for manufacturing the same, and method for manufacturing semiconductor device
- Patent Title (中): 掩模,其制造方法以及半导体器件的制造方法
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Application No.: US12716665Application Date: 2010-03-03
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Publication No.: US08129078B2Publication Date: 2012-03-06
- Inventor: Akira Imai , Junjiro Sakai
- Applicant: Akira Imai , Junjiro Sakai
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2009-053651 20090306
- Main IPC: G03F1/00
- IPC: G03F1/00 ; G03C5/00

Abstract:
A mask having mask patterns for the transfer of a desired circuit pattern, a method for manufacturing the mask, and a semiconductor device manufacturing method using the mask, are provided. There are extracted two rectangular aperture patterns which are adjacent each other in an obliquely disposed state with respect to an X axis in an XY plane. The thus-extracted two rectangular aperture patterns are rotated at a certain angle so that a pattern edge corresponding to one side of one of the rectangular aperture patterns and a pattern edge corresponding to one side of the other rectangular aperture pattern are opposed in parallel to each other. The two rectangular aperture patterns thus rotated at a certain angle are then subjected to optical proximity effect correction to form two corrected rectangular aperture patterns.
Public/Granted literature
- US20100227444A1 MASK, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2010-09-09
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