Invention Grant
- Patent Title: Liquid discharge head substrate, liquid discharge head using the substrate, and manufacturing method therefor
- Patent Title (中): 液体排出头基板，使用基板的排液头及其制造方法
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Application No.: US12841410Application Date: 2010-07-22
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Publication No.: US08129204B2Publication Date: 2012-03-06
- Inventor: Ichiro Saito , Teruo Ozaki , Takahiro Matsui , Sakai Yokoyama , Takuya Hatsui , Kazuaki Shibata
- Applicant: Ichiro Saito , Teruo Ozaki , Takahiro Matsui , Sakai Yokoyama , Takuya Hatsui , Kazuaki Shibata
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2006-026019 20060202; JP2006-065815 20060310; JP2006-070818 20060315; JP2006-131415 20060510; JP2006-325987 20061201
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
Provided is a liquid discharge head substrate including: a substrate; a heating resistor layer formed on the substrate; a flow path for a liquid; a wiring layer stacked on the heating resistor layer and having an end portion which forms a step portion on the heating resistor layer; and a protective layer covering the heating resistor layer and the wiring layer including the step portion, and formed between the heating resistor layer and the flow path, in which the protective layer is formed by a Cat-CVD method.
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