Invention Grant
- Patent Title: Solid-state imaging device and method for manufacturing the same
- Patent Title (中): 固态成像装置及其制造方法
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Application No.: US12545924Application Date: 2009-08-24
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Publication No.: US08129213B2Publication Date: 2012-03-06
- Inventor: Harumi Ikeda , Masashi Nakazawa
- Applicant: Harumi Ikeda , Masashi Nakazawa
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2008-217255 20080826
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
Disclosed herein is a solid-state imaging device including: a semiconductor layer; a charge accumulation region configured to be formed inside the semiconductor layer and serve as part of a photodiode; and a reflective surface configured to be disposed inside or under the charge accumulation region and be so formed as to reflect light that has passed through the charge accumulation region and direct the light toward a center part of the charge accumulation region.
Public/Granted literature
- US20100053400A1 SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-03-04
Information query
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