Invention Grant
US08129223B2 Nanotube modified solder thermal intermediate structure, systems, and methods
有权
纳米管改性焊料热中间体结构，体系及方法
- Patent Title: Nanotube modified solder thermal intermediate structure, systems, and methods
- Patent Title (中): 纳米管改性焊料热中间体结构，体系及方法
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Application No.: US11676448Application Date: 2007-02-19
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Publication No.: US08129223B2Publication Date: 2012-03-06
- Inventor: Paul A. Koning , Bryan M. White
- Applicant: Paul A. Koning , Bryan M. White
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder.
Public/Granted literature
- US20110168763A1 NANOTUBE MODIFIED SOLDER THERMAL INTERMEDIATE STRUCTURE, SYSTEMS, AND METHODS Public/Granted day:2011-07-14
Information query
IPC分类:
