Invention Grant
US08129224B2 Stud bumps as local heat sinks during transient power operations
有权
瞬态功率运行期间,当局部散热片时,螺柱凸起
- Patent Title: Stud bumps as local heat sinks during transient power operations
- Patent Title (中): 瞬态功率运行期间,当局部散热片时,螺柱凸起
-
Application No.: US12906240Application Date: 2010-10-18
-
Publication No.: US08129224B2Publication Date: 2012-03-06
- Inventor: Siva P Gurrum , Kapil H Sahasrabudhe , Vikas Gupta
- Applicant: Siva P Gurrum , Kapil H Sahasrabudhe , Vikas Gupta
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Wade J. Brady; Frederick J. Telecky, Jr.
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/48 ; H01L21/44

Abstract:
A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.
Public/Granted literature
- US20110027943A1 Stud Bumps as Local Heat Sinks During Transient Power Operations Public/Granted day:2011-02-03
Information query
IPC分类: