Invention Grant
- Patent Title: Method of manufacturing an integrated circuit module
- Patent Title (中): 集成电路模块的制造方法
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Application No.: US11837087Application Date: 2007-08-10
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Publication No.: US08129225B2Publication Date: 2012-03-06
- Inventor: Stefan Landau , Alexander Koenigsberger , Joachim Mahler , Klaus Schiess
- Applicant: Stefan Landau , Alexander Koenigsberger , Joachim Mahler , Klaus Schiess
- Applicant Address: DE
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method includes providing an integral array of first carriers, arranging first semiconductor chips on the first carriers, and arranging an integral array of second carriers over the semiconductor chips.
Public/Granted literature
- US20090042337A1 Method of Manufacturing an Integrated Circuit Module Public/Granted day:2009-02-12
Information query
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