Invention Grant
- Patent Title: Semiconductor substrates having low defects and methods of manufacturing the same
- Patent Title (中): 具有低缺陷的半导体衬底及其制造方法
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Application No.: US11802667Application Date: 2007-05-24
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Publication No.: US08129260B2Publication Date: 2012-03-06
- Inventor: Ho-sun Paek , Youn-joon Sung , Kyoung-ho Ha , Joong-kon Son , Sung-nam Lee
- Applicant: Ho-sun Paek , Youn-joon Sung , Kyoung-ho Ha , Joong-kon Son , Sung-nam Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung LED Co., Ltd.
- Current Assignee: Samsung LED Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2006-0068410 20060721
- Main IPC: H01L23/58
- IPC: H01L23/58

Abstract:
A semiconductor substrate includes a first semiconductor layer and a second semiconductor layer. The first semiconductor layer is formed of II-VI-group semiconductor material, III-V-group semiconductor material, or II-VI-group semiconductor material and III-V-group semiconductor material. At least one amorphous region and at least one crystalloid region are formed in the first semiconductor layer. The second semiconductor layer is formed on the first semiconductor layer and is crystal-grown from the at least one crystalloid region. A method of manufacturing a semiconductor substrate includes preparing a growth substrate; crystal-growing the first semiconductor layer on the growth substrate; forming the at least one amorphous region and the at least one crystalloid region in the first semiconductor layer; and forming a second semiconductor layer on the first semiconductor layer using the at least one amorphous region as a mask and the at least one crystalloid region as a seed.
Public/Granted literature
- US20080020552A1 Semiconductor substrates having low defects and methods of manufacturing the same Public/Granted day:2008-01-24
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