Invention Grant
- Patent Title: Wire bond interconnection and method of manufacture thereof
- Patent Title (中): 线接线互连及其制造方法
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Application No.: US13178331Application Date: 2011-07-07
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Publication No.: US08129263B2Publication Date: 2012-03-06
- Inventor: Hun-Teak Lee , Jong-Kook Kim , Chul-Sik Kim , Ki-Youn Jang , Rajendra D. Pendse
- Applicant: Hun-Teak Lee , Jong-Kook Kim , Chul-Sik Kim , Ki-Youn Jang , Rajendra D. Pendse
- Applicant Address: US CA Fremont
- Assignee: Chippac, Inc.
- Current Assignee: Chippac, Inc.
- Current Assignee Address: US CA Fremont
- Agent Mikio Ishimaru
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/48
Abstract:
A method of manufacture of a semiconductor package includes: providing a substrate; mounting a semiconductor die on the substrate, the semiconductor die having a die pad; mounting a lead finger on the substrate; attaching a support pedestal on sides of the lead finger; and attaching a wire interconnection between the die pad and the support pedestal, the wire interconnection having a ball bond on the die pad and a stitch bond on the support pedestal.
Public/Granted literature
- US20110266700A1 WIRE BOND INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2011-11-03
Information query
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