The present invention relates to a curing accelerating compound-silica composite material capable of giving excellent storage stability to a curable resin composition, which is obtained by subjecting one or more compounds selected from compounds represented by the general formula (I-1) below and partial condensates thereof to a sol-gel reaction in the presence of a curing accelerating compound and water; a curable resin composition comprising the same; and an electronic component device comprising a device sealed with the curable resin composition. R1nSiR2(4-n)  (I-1) wherein n is 0 or 1; R1 is selected from a hydrogen atom and a C1 to C18 substituted or unsubstituted hydrocarbon group and may form a ring structure with R2; R2s represent a functional group reactive with a phenolic hydroxyl group, are selected independently from a halogen atom, a hydroxyl group, a C1 to C18 optionally substituted oxy group, a C0 to C18 optionally substituted amino group, and a C2 to C18 optionally substituted carbonyloxy group, all R2s may be the same or different from one another, and two or more R2s may be bound to each other to form a ring structure.