Invention Grant
- Patent Title: Insulator for feedthrough
- Patent Title (中): 绝缘子馈通
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Application No.: US12469823Application Date: 2009-05-21
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Publication No.: US08129622B2Publication Date: 2012-03-06
- Inventor: William John Taylor , Brad C. Tischendorf
- Applicant: William John Taylor , Brad C. Tischendorf
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: H01B17/26
- IPC: H01B17/26
Abstract:
A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture; the feedthrough assembly comprises a conductive element housed in a glass insulating member. A second substrate is coupled to the first substrate.
Public/Granted literature
- US20090229858A1 INSULATOR FOR FEEDTHROUGH Public/Granted day:2009-09-17
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