Invention Grant
US08129626B2 Multilayer wiring substrate with a reinforcing layer for preventing a warp
有权
具有用于防止翘曲的增强层的多层布线基板
- Patent Title: Multilayer wiring substrate with a reinforcing layer for preventing a warp
- Patent Title (中): 具有用于防止翘曲的增强层的多层布线基板
-
Application No.: US12399450Application Date: 2009-03-06
-
Publication No.: US08129626B2Publication Date: 2012-03-06
- Inventor: Natsuko Ueda , Yuji Yukiiri
- Applicant: Natsuko Ueda , Yuji Yukiiri
- Applicant Address: JP Nagano-shi, Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi, Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2008-070681 20080319
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A multilayer wiring substrate having no core substrate is provided. The multilayer wiring substrate includes: a laminated body includes: a plurality of insulating layers; and a plurality of wiring layers. The laminated body has: a mounting surface on which a semiconductor element is mounted; and a bonding surface to which external connection terminals are bonded. At least one of the insulating layers contains a glass cloth.
Public/Granted literature
- US20090236135A1 MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-09-24
Information query
