Invention Grant
- Patent Title: Semiconductor light emitting device and semiconductor light emitting device mounted board
- Patent Title (中): 半导体发光器件和半导体发光器件安装板
-
Application No.: US11919558Application Date: 2006-07-12
-
Publication No.: US08129739B2Publication Date: 2012-03-06
- Inventor: Kazushi Higashi , Shinji Ishitani
- Applicant: Kazushi Higashi , Shinji Ishitani
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2005-206421 20050715
- International Application: PCT/JP2006/313851 WO 20060712
- International Announcement: WO2007/010793 WO 20070125
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
In a semiconductor light emitting device having a matrix of a plurality of bumps composed of one n-bump formed on an n-electrode layer and of a large number of p-bumps formed on p-electrode layers, the occurrence of a faulty junction after mounting can be suppressed by placement of the n-bump at center of the bump array, because the position at the center is most resistant to occurrence of stress after the mounting. Employment of such a configuration of bump array increases reliability of mounting thereof while improving uniformity of light emission intensity in the semiconductor light emitting device having an increased size.
Public/Granted literature
- US20100012965A1 Semiconductor light emitting device and semiconductor light emitting device mounted board Public/Granted day:2010-01-21
Information query
IPC分类: