Invention Grant
US08129739B2 Semiconductor light emitting device and semiconductor light emitting device mounted board 有权
半导体发光器件和半导体发光器件安装板

Semiconductor light emitting device and semiconductor light emitting device mounted board
Abstract:
In a semiconductor light emitting device having a matrix of a plurality of bumps composed of one n-bump formed on an n-electrode layer and of a large number of p-bumps formed on p-electrode layers, the occurrence of a faulty junction after mounting can be suppressed by placement of the n-bump at center of the bump array, because the position at the center is most resistant to occurrence of stress after the mounting. Employment of such a configuration of bump array increases reliability of mounting thereof while improving uniformity of light emission intensity in the semiconductor light emitting device having an increased size.
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