A light emitting device includes a light emitting element, an element mounting board including a wiring layer on an element mounting surface thereof, and a sealing portion that seals the light emitting element. The light emitting element includes a contact electrode including a transparent conductive film, a transparent dielectric layer formed on a surface of the contact electrode and including a refractive index lower than the contact electrode, and a pad electrode electrically connected to the contact electrode. The light emitting element is flip-chip mounted on the wiring layer. A part of the transparent dielectric layer is formed between the contact electrode and the pad electrode.