Invention Grant
- Patent Title: Nitride semiconductor device and method for fabricating the same
- Patent Title (中): 氮化物半导体器件及其制造方法
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Application No.: US11878352Application Date: 2007-07-24
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Publication No.: US08129748B2Publication Date: 2012-03-06
- Inventor: Yasuhiro Uemoto , Masahiro Hikita , Tetsuzo Ueda , Tsuyoshi Tanaka , Daisuke Ueda
- Applicant: Yasuhiro Uemoto , Masahiro Hikita , Tetsuzo Ueda , Tsuyoshi Tanaka , Daisuke Ueda
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-278913 20061012
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A nitride semiconductor device includes: a first nitride semiconductor layer; a second nitride semiconductor layer formed on the first nitride semiconductor layer and having a wider band gap than the first nitride semiconductor layer; and a third nitride semiconductor layer formed on the second nitride semiconductor layer. A region of the third nitride semiconductor layer located below the gate electrode is formed with a control region having a p-type conductivity, and a region of the third nitride semiconductor layer located between the gate electrode and each of the source electrode and the drain electrode is formed with a high resistive region having a higher resistance than the that of the control region.
Public/Granted literature
- US20080087915A1 Nitride semiconductor device and method for fabricating the same Public/Granted day:2008-04-17
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