Invention Grant
US08129754B2 Integrated circuit with gate electrode level including at least six linear-shaped conductive structures forming gate electrodes of transisters with at least one pair of linear-shaped conductive structures having offset ends 有权
具有栅极电极级的集成电路,其包括至少六个线性形状的导电结构,其形成具有至少一对具有偏移端的线性导电结构的转移器的栅电极

  • Patent Title: Integrated circuit with gate electrode level including at least six linear-shaped conductive structures forming gate electrodes of transisters with at least one pair of linear-shaped conductive structures having offset ends
  • Patent Title (中): 具有栅极电极级的集成电路,其包括至少六个线性形状的导电结构,其形成具有至少一对具有偏移端的线性导电结构的转移器的栅电极
  • Application No.: US12571343
    Application Date: 2009-09-30
  • Publication No.: US08129754B2
    Publication Date: 2012-03-06
  • Inventor: Scott T. BeckerMichael C. Smayling
  • Applicant: Scott T. BeckerMichael C. Smayling
  • Applicant Address: US CA Los Gatos
  • Assignee: Tela Innovations, Inc.
  • Current Assignee: Tela Innovations, Inc.
  • Current Assignee Address: US CA Los Gatos
  • Agency: Martine Penilla Group, LLP
  • Main IPC: H01L27/10
  • IPC: H01L27/10
Integrated circuit with gate electrode level including at least six linear-shaped conductive structures forming gate electrodes of transisters with at least one pair of linear-shaped conductive structures having offset ends
Abstract:
A cell of a semiconductor device is disclosed to include a diffusion level including a plurality of diffusion regions separated by inactive regions. The cell also includes a gate electrode level including a number of conductive features defined to extend in only a first parallel direction. Each of the conductive features within the gate electrode level is fabricated from a respective originating rectangular-shaped layout feature. The gate electrode level includes conductive features defined along at least four different virtual lines of extent in the first parallel direction. The cell also includes a number of interconnect levels formed above the gate electrode level.
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