Invention Grant
- Patent Title: Semiconductor element and manufacturing method therefor
- Patent Title (中): 半导体元件及其制造方法
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Application No.: US12676212Application Date: 2009-07-03
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Publication No.: US08129758B2Publication Date: 2012-03-06
- Inventor: Masao Uchida , Masashi Hayashi , Koichi Hashimoto
- Applicant: Masao Uchida , Masashi Hayashi , Koichi Hashimoto
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP2008-178810 20080709; JP2008-323682 20081219
- International Application: PCT/JP2009/003111 WO 20090703
- International Announcement: WO2010/004715 WO 20100114
- Main IPC: H01L27/10
- IPC: H01L27/10

Abstract:
A semiconductor device includes: a semiconductor layer including silicon carbide, which has been formed on a substrate; a semiconductor region 15 of a first conductivity type defined on the surface of the semiconductor layer 10; a semiconductor region 14 of a second conductivity type, which is defined on the surface 10s of the semiconductor layer so as to surround the semiconductor region 15 of the first conductivity type; and a conductor 19 with a conductive surface 19s that contacts with the semiconductor regions 15 and 14 of the first and second conductivity types. On the surface 10s of the semiconductor layer, the semiconductor region 15 of the first conductivity type has at least one first strip portion 60 that runs along a first axis i. The width C1 of the semiconductor region 15 of the first conductivity type as measured along the first axis i is greater than the width A1 of the conductive surface 19s as measured along the first axis i. And the periphery of the conductive surface 19s crosses the at least one first strip portion 60, 61.
Public/Granted literature
- US20100295062A1 SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR Public/Granted day:2010-11-25
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