Invention Grant
- Patent Title: Ferroelectric polymer memory module
- Patent Title (中): 铁电聚合物记忆模块
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Application No.: US12874124Application Date: 2010-09-01
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Publication No.: US08129767B2Publication Date: 2012-03-06
- Inventor: Lee D. Rockford , Ebrahim Andideh
- Applicant: Lee D. Rockford , Ebrahim Andideh
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
Ferroelectric polymer memory modules are described. In an example, a module has a first set of layers including a first ILD layer defining trenches therein, a first electrode layer disposed in the trenches of the first ILD layer, a first conductive polymer layer disposed on the first electrode layer and in the trenches of the first ILD layer, and a ferroelectric polymer layer disposed on the first conductive polymer layer, in and extending beyond the trenches of the first ILD layer. The module also has a second set of layers disposed on the first set of layers to define memory cells therewith. The second set of layers includes a second ILD layer defining trenches therein, a second conductive polymer layer disposed in the trenches of the second ILD layer, and a second electrode layer disposed on the second conductive polymer layer.
Public/Granted literature
- US20110073831A1 FERROELECTRIC POLYMER MEMORY DEVICE INCLUDING POLYMER ELECTRODES AND METHOD OF FABRICATING SAME Public/Granted day:2011-03-31
Information query
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