Invention Grant
US08129845B2 Semiconductor device and method of forming interconnect structure in non-active area of wafer
有权
在晶片的非有源区域中形成互连结构的半导体器件和方法
- Patent Title: Semiconductor device and method of forming interconnect structure in non-active area of wafer
- Patent Title (中): 在晶片的非有源区域中形成互连结构的半导体器件和方法
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Application No.: US12207324Application Date: 2008-09-09
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Publication No.: US08129845B2Publication Date: 2012-03-06
- Inventor: TaeHoan Jang , JaeHun Ku , XuSheng Bao
- Applicant: TaeHoan Jang , JaeHun Ku , XuSheng Bao
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC, Ltd.
- Current Assignee: STATS ChipPAC, Ltd.
- Current Assignee Address: SG Singapore
- Agency: Patent Law Group: Atkins & Associates, P.C.
- Agent Robert D. Atkins
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A semiconductor wafer includes a plurality of semiconductor die. Contact pads are formed on an active area of the semiconductor die and non-active area of the semiconductor wafer between the semiconductor die. Solder bumps are formed on the contact pads in both the active area of the semiconductor die and non-active area of the semiconductor wafer between the semiconductor die. The I/O terminal count of the semiconductor die is increased by forming solder bumps in the non-active area of the wafer. An encapsulant is formed over the solder bumps. The encapsulant provides structural support for the solder bumps formed in the non-active area of the semiconductor wafer. The semiconductor wafer undergoes grinding after forming the encapsulant to expose the solder bumps. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is mounted to a package substrate with solder paste or socket.
Public/Granted literature
- US20090079069A1 Semiconductor Device and Method of Forming Interconnect Structure in Non-Active Area of Wafer Public/Granted day:2009-03-26
Information query
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