Invention Grant
- Patent Title: Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device
- Patent Title (中): 适于安装电子设备，半导体模块及其制造方法的板和便携式设备
-
Application No.: US12266907Application Date: 2008-11-07
-
Publication No.: US08129846B2Publication Date: 2012-03-06
- Inventor: Tetsuya Yamamoto , Yoshio Okayama , Yasuyuki Yanase
- Applicant: Tetsuya Yamamoto , Yoshio Okayama , Yasuyuki Yanase
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-291342 20071108; JP2008-273591 20081023
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A board adapted to mount an electronic device includes an insulating resin layer, a wiring layer of a predetermined pattern provided on one surface of the insulating resin layer, a bump electrode provided on an insulating-resin-layer-side surface of the wiring layer, and a covering, formed of a metal layer, which covers a top surface of the bump electrode and a region, at a side surface of the bump electrode, continuous with the top surface excluding a region in contact with the wiring layer.
Public/Granted literature
Information query
IPC分类:
