An interconnect for mounting an electronic device to a substrate includes a base layer between the electronic device and the substrate in electrical communication with integrated circuits on the electronic device, a phase change layer on the base layer made of a material which is liquid at normal operating temperatures of the electronic device and a retaining layer surrounding the phase change layer, and configured to retain the phase change layer in liquid form on the base layer. A method for mounting an electronic device to a substrate includes the steps of: forming a base layer on the device (or on the substrate); forming a phase change layer on the base layer; placing the phase change layer in contact with a corresponding electrode on the substrate (or on the device); and then forming a retaining layer between the device and the substrate configured to surround the base layer, the phase change layer, and the electrode, and to retain the phase change layer in liquid form between the base layer and the electrode.