Invention Grant
- Patent Title: Sealing member of piezoelectric resonator device and manufacturing method therefor
- Patent Title (中): 压电谐振器装置的密封件及其制造方法
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Application No.: US12680921Application Date: 2009-08-04
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Publication No.: US08129888B2Publication Date: 2012-03-06
- Inventor: Naoki Kohda , Hiroki Yoshioka , Syunsuke Satoh
- Applicant: Naoki Kohda , Hiroki Yoshioka , Syunsuke Satoh
- Applicant Address: JP Kakogawa-shi
- Assignee: Daishinku Corporation
- Current Assignee: Daishinku Corporation
- Current Assignee Address: JP Kakogawa-shi
- Agency: Mots Law, PLLC
- Agent Marvin A. Motsenbocker
- Priority: JP2008-201882 20080805
- International Application: PCT/JP2009/063803 WO 20090804
- International Announcement: WO2010/016487 WO 20100211
- Main IPC: H01L41/08
- IPC: H01L41/08

Abstract:
A sealing member of a piezoelectric resonator device is configured to hermetically seal a driving electrode formed on a piezoelectric resonator plate. In the sealing member, a through hole is formed so that an electrode pattern formed on both major surfaces of the substrate is brought into conduction; and a conductive member fills in the through hole. The through hole has a smaller diameter at a portion thereof inside the substrate than at both end portions thereof at the major surfaces of the sealing member. Both end faces of the conductive member have a concave shape with respect to the major surfaces of the substrate of the sealing member.
Public/Granted literature
- US20100270891A1 SEALING MEMBER OF PIEZOELECTRIC RESONATOR DEVICE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2010-10-28
Information query
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