Invention Grant
- Patent Title: Semiconductor circuit board and semiconductor circuit
- Patent Title (中): 半导体电路板和半导体电路
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Application No.: US11922017Application Date: 2005-06-13
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Publication No.: US08130052B2Publication Date: 2012-03-06
- Inventor: Takashi Okano , Masaya Nishimura , Shuhei Kawamura
- Applicant: Takashi Okano , Masaya Nishimura , Shuhei Kawamura
- Applicant Address: JP Osaka
- Assignee: Daikin Industries Ltd.
- Current Assignee: Daikin Industries Ltd.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- International Application: PCT/JP2005/010785 WO 20050613
- International Announcement: WO2006/134629 WO 20061221
- Main IPC: H04B3/38
- IPC: H04B3/38 ; H03H7/00

Abstract:
The present invention is intended to efficiently implement noise countermeasures for a semiconductor circuit board and for a semiconductor circuit. The present invention is constituted by a control substrate, and a semiconductor circuit connected to the control substrate. The semiconductor circuit includes a substrate, an integrated circuit group, and a noise countermeasure, and is separated from the control substrate. The integrated circuit group includes an integrated circuit as a noise source. The substrate has a stacked multilayer structure, and shifts the frequency of a noise generated by the integrated circuit group to the high frequency side. The noise countermeasure is connected between the integrated circuit group and the control substrate. The noise countermeasure is a filter for attenuating the high frequency of a noise.
Public/Granted literature
- US20090278593A1 Semiconductor circuit board and semiconductor circuit Public/Granted day:2009-11-12
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