Invention Grant
- Patent Title: Electronic device and electronic assembly
- Patent Title (中): 电子设备和电子组装
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Application No.: US12129815Application Date: 2008-05-30
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Publication No.: US08130153B2Publication Date: 2012-03-06
- Inventor: Boon Ping Koh , Nur Ainunnazli Aminuddin , Seng Shin Lim , Sooliam Ooi
- Applicant: Boon Ping Koh , Nur Ainunnazli Aminuddin , Seng Shin Lim , Sooliam Ooi
- Applicant Address: US IL Schaumburg
- Assignee: Motorola Solutions, Inc.
- Current Assignee: Motorola Solutions, Inc.
- Current Assignee Address: US IL Schaumburg
- Agent Terri Hughes Smith; Anthony P. Curtis; Daniel R. Bestor
- Main IPC: H01Q1/24
- IPC: H01Q1/24
Abstract:
An electronic assembly and electronic device used for radio frequency communications are presented. The electronic device has a housing and an antenna feed point at least partially enclosed in the housing. There is at least one circuit board enclosed in the housing. An antenna counterpoise is coupled to the feed point. The counterpoise is enclosed in the housing and the counterpoise includes a foldable metallic patch that is folded around the circuit board such that the circuit board is sandwiched between opposite facing portions of the foldable metallic patch.
Public/Granted literature
- US20090295647A1 ELECTRONIC DEVICE AND ELECTRONIC ASSEMBLY Public/Granted day:2009-12-03
Information query
