Invention Grant
- Patent Title: Method for coarse wafer alignment in a lithographic apparatus
- Patent Title (中): 光刻设备中的粗晶片对准方法
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Application No.: US12395091Application Date: 2009-02-27
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Publication No.: US08130366B2Publication Date: 2012-03-06
- Inventor: Patrick Warnaar , Franciscus Godefridus Casper Bijnen
- Applicant: Patrick Warnaar , Franciscus Godefridus Casper Bijnen
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: G01B11/00
- IPC: G01B11/00 ; G03B27/32 ; G03B27/42 ; G03B27/54 ; G03B27/74

Abstract:
A method for alignment of a substrate, in which the substrate includes a mark in a scribe lane, and the scribe lane extends along a longitudinal direction as a first direction. The mark has a periodic structure in the first direction. The method includes providing an illumination beam for scanning the mark in a direction perpendicular to a direction of the mark's periodic structure along a first scan path across the mark, scanning the spot of the illumination beam along a second scan path across the mark, the second scan path being parallel to the first scan path, wherein the second scan path is shifted relative to the first scan path over a first shift that corresponds to a fraction of the repeating distance of the periodic structure.
Public/Granted literature
- US20090237637A1 METHOD FOR COARSE WAFER ALIGNMENT IN A LITHOGRAPHIC APPARATUS Public/Granted day:2009-09-24
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