Invention Grant
- Patent Title: Electronic component and method of manufacturing the same
- Patent Title (中): 电子部件及其制造方法
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Application No.: US12498572Application Date: 2009-07-07
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Publication No.: US08130486B2Publication Date: 2012-03-06
- Inventor: Kazuya Kawahara , Yuuki Murata , Takashi Oda
- Applicant: Kazuya Kawahara , Yuuki Murata , Takashi Oda
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2008-179839 20080710; JP2008-179840 20080710; JP2008-179841 20080710
- Main IPC: H01G4/32
- IPC: H01G4/32 ; H01G9/04 ; H01G9/10

Abstract:
An electronic component includes a functional element, first and second collectors joined to the functional element, and an outer package integrally covering the functional element and the first and second collectors. The functional element has first and second end surfaces having circular shapes and a side surface having a cylindrical shape extending along a center axis. The element includes first and second electrode foils rolled about the center axis and exposed from the first and second surfaces, respectively. The outer package has first and second surfaces parallel to the first and second end surfaces of the functional element, and has first to fourth corners as seen from a direction of the center axis. The first corner is adjacent to the second corner. The first and second terminals are arranged at the first and second corners of the outer package, respectively. This electronic component can have a small size and a small height while reducing its equivalent series resistance.
Public/Granted literature
- US20100014217A1 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-01-21
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