Invention Grant
US08130493B2 Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method
有权
布置用于最佳散热的电路板部件的方法和具有通过执行该方法而布置的部件的电路装置
- Patent Title: Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method
- Patent Title (中): 布置用于最佳散热的电路板部件的方法和具有通过执行该方法而布置的部件的电路装置
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Application No.: US12389723Application Date: 2009-02-20
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Publication No.: US08130493B2Publication Date: 2012-03-06
- Inventor: Tae-kwon Na
- Applicant: Tae-kwon Na
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: Staas & Halsey LLP
- Priority: KR10-2008-58360 20080620
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K3/30 ; F28F7/00 ; H01L23/34
Abstract:
A method of arranging a plurality of components of a circuit board for optimal heat dissipation and a circuit apparatus having a plurality of components arranged by performing the method are provided. The method includes arranging a predetermined number of the plurality of components in the order of size of the components in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit.
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