A modular patch panel module is mountable on an electronics enclosure and includes an angled patch face and mounting structure that enables stacking of modular patch panels without interference of patch panel cords with the top of the enclosure or another patch panel stacked thereon. The patch panel modules may each contain a plurality of RJ-45 ports and punchdown blocks. A cover plate may snap fit to the module to retain the patch panel electrical components therebetween.