Invention Grant
- Patent Title: Printed circuit board assembly of electronic appliance
- Patent Title (中): 电子电器印刷电路板总成
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Application No.: US12453119Application Date: 2009-04-29
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Publication No.: US08130510B2Publication Date: 2012-03-06
- Inventor: Sang Wook Jang , Matsumoto Satoru
- Applicant: Sang Wook Jang , Matsumoto Satoru
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey LLP
- Priority: KR10-2008-0113103 20081114
- Main IPC: D06F33/00
- IPC: D06F33/00 ; D06B1/00 ; D06F33/02

Abstract:
Disclosed herein is a printed circuit board assembly of an electronic appliance including a plurality of boards on which electrical parts to perform functions necessary for the electronic appliance are separately arranged according to the specification of the electronic appliance. The printed circuit board assembly is divided into a plurality of boards, such that electrical parts having a common specification and electrical parts having different specifications are arranged on different boards, thereby optimizing the printed circuit board assembly and configuring the boards according to the specification of the electronic appliance without loss. Microprocessors are arranged on the boards, and the boards are connected to each other in a serial communication, thereby reducing the number of wiring harnesses (W/H) and thus configuring the printed circuit board assembly with high reliability. Furthermore, the boards are connected to each other in an insulation manner, thereby configuring the boards in an anti-resistance structure.
Public/Granted literature
- US20100122841A1 Printed circuit board assembly of electronic appliance Public/Granted day:2010-05-20
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