Invention Grant
- Patent Title: Cooling arrangement for voice coil of speaker
- Patent Title (中): 扬声器音圈的冷却布置
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Application No.: US11889796Application Date: 2007-08-16
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Publication No.: US08131000B2Publication Date: 2012-03-06
- Inventor: Steff Lin
- Applicant: Steff Lin
- Applicant Address: TW Taipei
- Assignee: Hi-Tech Sound System Co., Ltd.
- Current Assignee: Hi-Tech Sound System Co., Ltd.
- Current Assignee Address: TW Taipei
- Agency: Bacon & Thomas, PLLC
- Main IPC: H04R1/00
- IPC: H04R1/00

Abstract:
A cooling arrangement for voice coil of speaker is disclosed to include a first bearing cup, a second bearing cup inserted into a top opening of the first bearing cup with a top flange thereof stopped at the top side of the first bearing cup to support a voice coil inside the first bewaring cup, and a conical outer holding down cup sleeved onto the first bearing cup to hold down a damper on a bottom flange of the first bearing cup and having a top edge bonded to a cone paper.
Public/Granted literature
- US20090046887A1 Cooling arrangement for voice coil of speaker Public/Granted day:2009-02-19
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