Invention Grant
- Patent Title: 90 degree ply placement system and method
- Patent Title (中): 90度层布置系统和方法
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Application No.: US11870062Application Date: 2007-10-10
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Publication No.: US08131395B2Publication Date: 2012-03-06
- Inventor: David W. Johnson , Scott A. Garrett , Stephen C. Moyers
- Applicant: David W. Johnson , Scott A. Garrett , Stephen C. Moyers
- Applicant Address: US CA Chula Vista
- Assignee: Ebert Composites Corporation
- Current Assignee: Ebert Composites Corporation
- Current Assignee Address: US CA Chula Vista
- Agency: Procopio Cory Hargreaves & Savitch LLP
- Agent Stephen C. Beuerle
- Main IPC: G06F19/00
- IPC: G06F19/00
Abstract:
A method of placing a 90 degree ply on a separate 0 degree material includes providing 90 degree ply from a 90 degree ply material source; moving the 90 degree ply in a 90 degree ply carrier to a position over the 0 degree material; removing the 90 degree ply carrier from the 0 degree material and simultaneously pushing the 90 degree ply off of the 90 degree ply carrier and onto the 0 degree material; and severing the 90 degree ply from the 90 degree ply material source so that the 90 degree ply remains on the 0 degree material.
Public/Granted literature
- US20080091293A1 90 Degree Ply Placement System and Method Public/Granted day:2008-04-17
Information query
