Invention Grant
- Patent Title: Property measurement apparatus and property measurement method
- Patent Title (中): 物性测量仪器和性能测量方法
-
Application No.: US12472630Application Date: 2009-05-27
-
Publication No.: US08132446B2Publication Date: 2012-03-13
- Inventor: Yoshihito Hayashi
- Applicant: Yoshihito Hayashi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2008-140530 20080529
- Main IPC: G01N11/14
- IPC: G01N11/14

Abstract:
Disclosed herein is a property measurement apparatus including: a first plate installed in a state of being rotatable and/or vibratable; and a second plate placed to face the first plate and provided with an impedance measurement section, wherein a stress caused by a distortion generated by rotating or vibrating the first plate to serve as a distortion given to a sample provided in a gap between the first and second plates is measured, and at the same time, the impedance measurement section measures the impedance of the sample.
Public/Granted literature
- US20090293595A1 PROPERTY MEASUREMENT APPARATUS AND PROPERTY MEASUREMENT METHOD Public/Granted day:2009-12-03
Information query