Invention Grant
- Patent Title: Sensor element placement for package stress compensation
- Patent Title (中): 用于封装应力补偿的传感器元件放置
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Application No.: US12184159Application Date: 2008-07-31
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Publication No.: US08132465B1Publication Date: 2012-03-13
- Inventor: Michael B. Doelle , Joachim Bergmann
- Applicant: Michael B. Doelle , Joachim Bergmann
- Applicant Address: US CA Milpitas
- Assignee: Silicon Microstructures, Inc.
- Current Assignee: Silicon Microstructures, Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: G01L9/00
- IPC: G01L9/00 ; G01L9/16
Abstract:
Circuits, methods, and systems that calibrate or account for packaging and related stress components in a pressure sensor. Further examples provide an improved sensor element or device. One example provides one or more sensing elements on the diaphragm and near the diaphragm-bulk boundary. Sensors near the diaphragm-bulk are used to estimate package-induced stress. This estimation can then be used in calibrating package stress from pressure measurements.
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