Invention Grant
- Patent Title: Substrate processing system and substrate cleaning apparatus including a jetting apparatus
- Patent Title (中): 基板处理系统和基板清洗装置，包括喷射装置
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Application No.: US12057807Application Date: 2008-03-28
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Publication No.: US08132580B2Publication Date: 2012-03-13
- Inventor: Tsuyoshi Moriya , Tadashi Onishi , Ryo Nonaka , Eiichi Nishimura
- Applicant: Tsuyoshi Moriya , Tadashi Onishi , Ryo Nonaka , Eiichi Nishimura
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-089803 20070329
- Main IPC: B08B3/00
- IPC: B08B3/00
Abstract:
A substrate processing system that enables foreign matter adhered to a rear surface or a periphery of a substrate to be completely removed. A substrate processing apparatus performs predetermined processing on the substrate. A substrate cleaning apparatus cleans the substrate at least one of before and after the predetermined processing. A jetting apparatus jets a cleaning substance in two phases of a gas phase and a liquid phase and a high-temperature gas towards the rear surface or the periphery of the substrate.
Public/Granted literature
- US20080236634A1 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE CLEANING APPARATUS Public/Granted day:2008-10-02
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