Invention Grant
- Patent Title: Packaging for electrical components
- Patent Title (中): 电气元件包装
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Application No.: US12349879Application Date: 2009-01-07
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Publication No.: US08132668B2Publication Date: 2012-03-13
- Inventor: Jerald Daniel Davis
- Applicant: Jerald Daniel Davis
- Applicant Address: US MI Lansing
- Assignee: The John Henry Company
- Current Assignee: The John Henry Company
- Current Assignee Address: US MI Lansing
- Agency: Price Heneveld LLP
- Main IPC: B65D85/86
- IPC: B65D85/86 ; B65D85/57

Abstract:
A package made from a biodegradable material, such as paperboard, utilizes multi-layered sheets of relatively thin material which can be cut to desired shapes relatively inexpensively and folded into adjacent layers which are adhesively attached to one another to form the package. In a preferred embodiment of the invention, the package defines a book-like package having an outer envelope with one side defining a sleeve for receiving a disk and an opposite side which receives a laminated multi-layered holder having a pocket in the shape of a memory chip/card or other electronic component to be held therein.
Public/Granted literature
- US20100170814A1 PACKAGING FOR ELECTRICAL COMPONENTS Public/Granted day:2010-07-08
Information query
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