Invention Grant
US08132668B2 Packaging for electrical components 有权
电气元件包装

Packaging for electrical components
Abstract:
A package made from a biodegradable material, such as paperboard, utilizes multi-layered sheets of relatively thin material which can be cut to desired shapes relatively inexpensively and folded into adjacent layers which are adhesively attached to one another to form the package. In a preferred embodiment of the invention, the package defines a book-like package having an outer envelope with one side defining a sleeve for receiving a disk and an opposite side which receives a laminated multi-layered holder having a pocket in the shape of a memory chip/card or other electronic component to be held therein.
Public/Granted literature
Information query
Patent Agency Ranking
0/0