Invention Grant
US08132892B2 Maintainable coplanar front face for silicon die array printhead
有权
用于硅芯片阵列打印头的可维护的共面正面
- Patent Title: Maintainable coplanar front face for silicon die array printhead
- Patent Title (中): 用于硅芯片阵列打印头的可维护的共面正面
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Application No.: US12536196Application Date: 2009-08-05
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Publication No.: US08132892B2Publication Date: 2012-03-13
- Inventor: Peter J. Nystrom , Peter M. Gulvin , John P. Meyers
- Applicant: Peter J. Nystrom , Peter M. Gulvin , John P. Meyers
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: MH2 Technology Law Group LLP
- Main IPC: B41J2/155
- IPC: B41J2/155
Abstract:
A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
Public/Granted literature
- US20090289994A1 MAINTAINABLE COPLANAR FRONT FACE FOR SILICON DIE ARRAY PRINTHEAD Public/Granted day:2009-11-26
Information query
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