Invention Grant
- Patent Title: Light emitting diode substrate module and method of manufacturing the same, and backlight unit and method of manufacturing the same
- Patent Title (中): 发光二极管基板模块及其制造方法,以及背光单元及其制造方法
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Application No.: US12244393Application Date: 2008-10-02
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Publication No.: US08132953B2Publication Date: 2012-03-13
- Inventor: Jung Kyu Park , Seong Ah Joo , Seung Hwan Choi
- Applicant: Jung Kyu Park , Seong Ah Joo , Seung Hwan Choi
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung LED Co., Ltd.
- Current Assignee: Samsung LED Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2007-0136264 20071224
- Main IPC: F21V7/04
- IPC: F21V7/04

Abstract:
There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing.Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.
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