Invention Grant
US08132953B2 Light emitting diode substrate module and method of manufacturing the same, and backlight unit and method of manufacturing the same 失效
发光二极管基板模块及其制造方法,以及背光单元及其制造方法

Light emitting diode substrate module and method of manufacturing the same, and backlight unit and method of manufacturing the same
Abstract:
There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing.Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.
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