Invention Grant
- Patent Title: Temperature compensation element for a connection unit
- Patent Title (中): 连接单元的温度补偿元件
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Application No.: US10550781Application Date: 2003-10-02
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Publication No.: US08132963B2Publication Date: 2012-03-13
- Inventor: Wolfgang Klumpp , Willi Maier , Wigand Schneiderheinze
- Applicant: Wolfgang Klumpp , Willi Maier , Wigand Schneiderheinze
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Priority: DE10314406U 20030328
- International Application: PCT/DE03/03288 WO 20031002
- International Announcement: WO2004/088797 WO 20041014
- Main IPC: G01K7/00
- IPC: G01K7/00 ; H02B1/20

Abstract:
The aim of the invention is to reduce the temperature gradient at the connection terminals of a connection unit to which lines can be joined. The inventive temperature compensation element is made of at least one first strip of thermally conducting material on which terminal lugs are arranged in a row at essentially right angles to the strip and are insulted in relation to each other and the strip. The terminal lugs are connected to the strip in a thermally conductive manner and can be respectively contacted to the lines with corresponding contact terminals of the connection unit.
Public/Granted literature
- US20100323553A1 Temperature Compensation Element for a Connection Unit Public/Granted day:2010-12-23
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