Invention Grant
- Patent Title: Selective sintering of compacted components
- Patent Title (中): 压实组件的选择性烧结
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Application No.: US12144746Application Date: 2008-06-24
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Publication No.: US08133329B2Publication Date: 2012-03-13
- Inventor: Shekhar G. Wakade
- Applicant: Shekhar G. Wakade
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Main IPC: H01F1/22
- IPC: H01F1/22 ; B22F3/087 ; B22F3/12
Abstract:
One embodiment includes compacting a powder material using at least a first magnetic field to form a compact and selectively sintering a first portion of the compact and leaving a second portion of the compact unsintered to form a component.
Public/Granted literature
- US20090317279A1 SELECTIVE SINTERING OF COMPACTED COMPONENTS Public/Granted day:2009-12-24
Information query
