Invention Grant
US08133367B1 Sputtering system and method using a loose granular sputtering target
有权
溅射系统和使用松散颗粒溅射靶的方法
- Patent Title: Sputtering system and method using a loose granular sputtering target
- Patent Title (中): 溅射系统和使用松散颗粒溅射靶的方法
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Application No.: US11503227Application Date: 2006-08-11
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Publication No.: US08133367B1Publication Date: 2012-03-13
- Inventor: Daniel Bruce Mitchell
- Applicant: Daniel Bruce Mitchell
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Christie, Parker & Hale, LLP
- Main IPC: C23C14/32
- IPC: C23C14/32
Abstract:
Sputtering is performed using a sputtering system having a sputtering source having a sputtering medium, a sputtering target positioned so as to be impinged upon by the sputtering medium of the sputtering source, wherein the sputtering target comprises a mass of a first loose granular material, and an open-top vessel in which the mass of the first loose granular material of the sputtering target is received and positioned so that the first loose granular material does not fall out of the open-top vessel by gravity. Some of the first loose granular material is sputtered from the sputtering target, a quantity of a second loose granular material is added to the mass of the first loose granular material in the open-top vessel, and thereafter some of the second loose granular material is sputtered from the sputtering target.
Information query
IPC分类:
