Invention Grant
- Patent Title: Conductive material
- Patent Title (中): 导电材料
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Application No.: US12472554Application Date: 2009-05-27
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Publication No.: US08133432B2Publication Date: 2012-03-13
- Inventor: Koichi Hasegawa
- Applicant: Koichi Hasegawa
- Applicant Address: JP Tokyo
- Assignee: Ishifuku Metal Industry Co., Ltd.
- Current Assignee: Ishifuku Metal Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Browdy and Neimark, PLLC
- Priority: JP2008-140169 20080528
- Main IPC: C22C5/04
- IPC: C22C5/04

Abstract:
Provided is a conductive material to be used for a resistor and a sensor, which is enhanced its mechanical strength while maintaining a stable resistance ratio. In the conductive material used for the resistor and the sensor, 400 to 10,000 ppm of Sr is contained in Pt, and the balance is an inevitable impurity. An intermetallic compound phase formed of Pt and Sr is precipitated and dispersed in Pt.
Public/Granted literature
- US20090297389A1 CONDUCTIVE MATERIAL Public/Granted day:2009-12-03
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