Invention Grant
- Patent Title: Leadframe
- Patent Title (中): 引线框架
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Application No.: US12431128Application Date: 2009-04-28
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Publication No.: US08133759B2Publication Date: 2012-03-13
- Inventor: Jui-Chung Lee , Po-Hsin Lin , Kun-Feng Lee
- Applicant: Jui-Chung Lee , Po-Hsin Lin , Kun-Feng Lee
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes Beffel & Wolfeld LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A leadframe includes a die paddle and leads, in which the back side of the die paddle has a fillister. The fillister defines a rim surrounding a recess, and the recess accommodates protrusion of fusible material. Also, a package includes such a leadframe. Also, a method for making a leadframe includes patterning a sheet of metal to form a die paddle and leads, and forming a fillister in the back side of the die paddle.
Public/Granted literature
- US20100270665A1 Leadframe Public/Granted day:2010-10-28
Information query
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