Semiconductor device and method for manufacturing the same

Invention Grant

US08133770B2 Semiconductor device and method for manufacturing the same 失效

Title translation: 半导体装置及其制造方法

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Patent Title: Semiconductor device and method for manufacturing the same
Patent Title (中): 半导体装置及其制造方法
Application No.: US13010087

Application Date: 2011-01-20
Publication No.: US08133770B2

Publication Date: 2012-03-13
Inventor: Yasuhiko Takemura
Applicant: Yasuhiko Takemura
Applicant Address: JP Atsugi-shi, Kanagawa-ken
Assignee: Semiconductor Energy Laboratory Co., Ltd.
Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
Agency: Robinson Intellectual Property Law Office, P.C.
Agent Eric J. Robinson
Priority: JP5-235461 19930827
Main IPC: H01L21/84
IPC: H01L21/84

Semiconductor device and method for manufacturing the same

Abstract:

A silicon film is crystallized in a predetermined direction by selectively adding a metal element having a catalytic action for crystallizing an amorphous silicon and annealing. In manufacturing TFT using the crystallized silicon film, TFT provided such that the crystallization direction is roughly parallel to a current-flow between a source and a drain, and TFT provided such that the crystallization direction is roughly vertical to a current-flow between a source and a drain are manufactured. Therefore, TFT capable of conducting a high speed operation and TFT having a low leak current are formed on the same substrate.

Abstract(Chinese):

通过选择性地添加具有用于结晶非晶硅的催化作用的金属元素和退火，使硅膜沿预定方向结晶。在制造使用结晶硅膜的TFT中，TFT被提供为使得结晶方向大致平行于源极和漏极之间的电流，并且TFT被设置为使得结晶方向大致垂直于源极之间的电流并制造漏极。因此，能够进行高速运算的TFT和具有低漏电流的TFT形成在同一基板上。

Public/Granted literature

US20110111541A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-05-12

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/84	.....衬底不是半导体的，例如绝缘体