Invention Grant
- Patent Title: Controlling warping in integrated circuit devices
- Patent Title (中): 集成电路器件控制翘曲
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Application No.: US13041674Application Date: 2011-03-07
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Publication No.: US08133799B2Publication Date: 2012-03-13
- Inventor: John W. Osenbach , Thomas H. Shilling , Weidong Xie
- Applicant: John W. Osenbach , Thomas H. Shilling , Weidong Xie
- Applicant Address: US PA Allentown
- Assignee: Agere Systems Inc.
- Current Assignee: Agere Systems Inc.
- Current Assignee Address: US PA Allentown
- Agency: Ryan, Mason & Lewis, LLP
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/46
Abstract:
Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.
Public/Granted literature
- US20110250742A1 CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES Public/Granted day:2011-10-13
Information query
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