Invention Grant
- Patent Title: Circuit carrier
- Patent Title (中): 电路载体
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Application No.: US12314086Application Date: 2008-12-03
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Publication No.: US08134083B2Publication Date: 2012-03-13
- Inventor: Bernd Haegele
- Applicant: Bernd Haegele
- Applicant Address: AT Salzburg
- Assignee: AB Mikroelektronik Gesselschaft mit beschrankter Haftung
- Current Assignee: AB Mikroelektronik Gesselschaft mit beschrankter Haftung
- Current Assignee Address: AT Salzburg
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: ATA973/2006 20060607
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the dielectric layer having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.
Public/Granted literature
- US20090205858A1 Circuit carrier Public/Granted day:2009-08-20
Information query
