Invention Grant
- Patent Title: Chip-type LED having an insulating substrate in which a first concave hole and a second concave hole are formed
- Patent Title (中): 具有形成有第一凹孔和第二凹孔的绝缘基板的芯片型LED
-
Application No.: US12171914Application Date: 2008-07-11
-
Publication No.: US08134160B2Publication Date: 2012-03-13
- Inventor: Makoto Matsuda
- Applicant: Makoto Matsuda
- Applicant Address: JP Osaka-shi
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka-shi
- Agency: Morrison & Foerster LLP
- Priority: JP2007-183342 20070712
- Main IPC: H01L27/15
- IPC: H01L27/15
Abstract:
An embodiment of the present invention has an insulating substrate in which a first concave hole for mounting an LED chip and a second concave hole for connecting a metallic small-gauge wire are formed, where a metallic sheet that serves as a first wiring pattern is formed at a portion that includes the first concave hole, a metallic sheet that serves as a second wiring pattern is formed at a portion that includes the second concave hole, an LED chip is mounted upon the metallic sheet inside the first concave hole, the LED chip is electrically connected to the metallic sheet inside the second concave hole via a metallic small-gauge wire, and the chip-type LED is sealed with a clear resin.
Public/Granted literature
- US20090014749A1 CHIP-TYPE LED AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-01-15
Information query
IPC分类:
