Invention Grant
- Patent Title: Method for manufacturing electronic device and electronic device
- Patent Title (中): 电子设备和电子设备的制造方法
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Application No.: US10540384Application Date: 2003-12-24
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Publication No.: US08134162B2Publication Date: 2012-03-13
- Inventor: Naoki Sumi
- Applicant: Naoki Sumi
- Applicant Address: HK Shatin
- Assignee: TPO Hong Kong Holding Limited
- Current Assignee: TPO Hong Kong Holding Limited
- Current Assignee Address: HK Shatin
- Agency: Liu & Liu
- Priority: JP2002-381362 20021227
- International Application: PCT/JP03/16652 WO 20031224
- International Announcement: WO2004/061521 WO 20040722
- Main IPC: H01L27/15
- IPC: H01L27/15
Abstract:
A method for manufacturing an electronic device comprises a step for forming a coating film (100) on a surface of a conductor portion-containing body (500), a step for forming a photosensitive film (110) on the conductor (500) on which the coating film (100) has been formed, a step for exposing the photosensitive film (110) to a pattern corresponding to a patterned recessed or protruded portion, a step for developing the exposed photosensitive film (110), and a step for baking the developed photosensitive film (110). With this method, an excessive removal of a metal film can be prevented or suppressed.
Public/Granted literature
- US20070015354A1 Method for manufacturing electronic device and electronic device Public/Granted day:2007-01-18
Information query
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