Invention Grant
- Patent Title: Integrated circuit including linear-shaped conductive structures that have gate portions and extending portions of different size
- Patent Title (中): 集成电路包括具有栅极部分和不同尺寸的延伸部分的线性导电结构
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Application No.: US12567616Application Date: 2009-09-25
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Publication No.: US08134183B2Publication Date: 2012-03-13
- Inventor: Scott T. Becker , Michael C. Smayling
- Applicant: Scott T. Becker , Michael C. Smayling
- Applicant Address: US CA Los Gatos
- Assignee: Tela Innovations, Inc.
- Current Assignee: Tela Innovations, Inc.
- Current Assignee Address: US CA Los Gatos
- Agency: Martine Penilla Group, LLP
- Main IPC: H01L27/10
- IPC: H01L27/10

Abstract:
A semiconductor device includes a substrate portion having a plurality of diffusion regions defined therein. A gate electrode level region is formed above the substrate portion to include conductive features defined to extend in only a first parallel direction. Adjacent ones of the conductive features that share a common line of extent are fabricated from respective originating layout features separated from each other by an end-to-end spacing of substantially equal and minimum size across the gate electrode level region. A width of the conductive features within a 5 wavelength photolithographic interaction radius is less than a 193 nanometer wavelength of light used in a photolithography process for their fabrication. Some conductive features extend over the plurality of diffusion regions to form PMOS or NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the gate electrode level region is greater than or equal to eight.
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Information query
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