Invention Grant
US08134196B2 Integrated circuit system with metal-insulator-metal circuit element
有权
具有金属绝缘体金属电路元件的集成电路系统
- Patent Title: Integrated circuit system with metal-insulator-metal circuit element
- Patent Title (中): 具有金属绝缘体金属电路元件的集成电路系统
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Application No.: US11469576Application Date: 2006-09-01
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Publication No.: US08134196B2Publication Date: 2012-03-13
- Inventor: Yaojian Lin , Haijing Cao , Wan Lay Looi , Eng Seng Lim
- Applicant: Yaojian Lin , Haijing Cao , Wan Lay Looi , Eng Seng Lim
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L21/8242
Abstract:
An integrated circuit system is provided including forming a substrate, forming a first contact having multiple conductive layers over the substrate and a layer of the multiple conductive layers on other layers of the multiple conductive layers, forming a dielectric layer on the first contact, and forming a second contact on the dielectric layer and over the first contact.
Public/Granted literature
- US20070108615A1 INTEGRATED CIRCUIT SYSTEM WITH METAL-INSULATOR-METAL CIRCUIT ELEMENT Public/Granted day:2007-05-17
Information query
IPC分类:
