Invention Grant
US08134446B2 Electrical component with a sensor element, method for the encapsulation of a sensor element, and method for production of a plate arrangement
有权
具有传感器元件的电气部件，用于封装传感器元件的方法，以及用于制造板装置的方法
- Patent Title: Electrical component with a sensor element, method for the encapsulation of a sensor element, and method for production of a plate arrangement
- Patent Title (中): 具有传感器元件的电气部件，用于封装传感器元件的方法，以及用于制造板装置的方法
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Application No.: US12349363Application Date: 2009-01-06
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Publication No.: US08134446B2Publication Date: 2012-03-13
- Inventor: Gerald Kloiber , Adalbert Feltz , Claus Cernoch
- Applicant: Gerald Kloiber , Adalbert Feltz , Claus Cernoch
- Applicant Address: DE Munich
- Assignee: Epcos AG
- Current Assignee: Epcos AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102006031344 20060706
- Main IPC: H01C3/04
- IPC: H01C3/04
Abstract:
An electrical component is specified with a sensor element, which is embedded in a plate arrangement. The plate arrangement includes at least three plates and conductor tracks, which are located between them and are conductively connected with the sensor element. At least two of the conductor tracks have exposed areas. Furthermore, a method for the encapsulation of a sensor element and a method for the production of a plate arrangement are specified.
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