Invention Grant
- Patent Title: Defect inspecting method and apparatus
- Patent Title (中): 缺陷检查方法和装置
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Application No.: US12774379Application Date: 2010-05-05
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Publication No.: US08134701B2Publication Date: 2012-03-13
- Inventor: Shuichi Chikamatsu , Minori Noguchi , Kenji Aiko
- Applicant: Shuichi Chikamatsu , Minori Noguchi , Kenji Aiko
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-068479 20060314
- Main IPC: G01N21/00
- IPC: G01N21/00

Abstract:
A defect inspecting apparatus of the invention solves a problem that in a defect inspecting apparatus, because of improving detection sensitivity of a microscopic defect by reducing a detection pixel size, a focal depth becomes shallow, a height of imaging is varied due to environmental change and the detection sensitivity of a defect becomes unstable. This apparatus comprises an XY stage, which carries a substrate to be inspected and scans in a predetermined direction, and a mechanism having a system of irradiating a defect on the inspected substrate at a slant and detecting the defect by a detection optical system disposed on the upper side, which corrects a height of imaging in real time for change in temperature and barometric pressure in order to keep the imaging in a best condition.
Public/Granted literature
- US20100214561A1 DEFECT INSPECTING APPARATUS Public/Granted day:2010-08-26
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